Brian Rosenbloom at TechConnect World Innovation Conference

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Washington, D.C.

Partner Brian Rosenbloom will present at the TechConnect World Innovation Conference & Expo, taking place June 13-15, 2022, in Washington, D.C. Brian's session, scheduled for Monday, June 13, is titled "How to Protect Your Valuable IP." He will also be a Review Panelist for the firm-sponsored Electronics, Sensors, and Communications Innovation Spotlights session.

For over 20 years the TechConnect World Innovation Conference and Expo has connected top applied research and early-stage innovations from universities, labs, and startups with industry end-users and prospectors. The 2022 TechConnect World Innovation event includes the annual SBIR/STTR Innovation Conference, AI TechConnect, and the TechConnect Technical Program - more than 35 world-class technical symposium, and the Nanotech Conference Series – the world's largest and longest running nanotechnology event.

To learn more about the event, please click here.

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